文章来源：由「百度新聞」平台非商業用途取用"https://newseg.pro/2018/11/06/global-light-emitting-diode-packaging-equipment-market-segmentation-based-on-product-types-applications-regions-and-forecast-to-2025/"

LED is the acronym of Light Emitting Diode. It is a kind of semiconductor device that is commonly used in indicator light and display board. LED is capable of transforming electric energy into light energy directly in high efficiency and its life-span can reach as long as tens of thousands hours to one hundred thousand hours. Compared to traditional bulbs, LED also bears the advantages of non-friable and power-saving and so on.
The requirements for LED packaging are strict. It is essential to use high-precision crystal solid machine to package no matter Lamp-LED or Surface Mount Device LED (SMD-LED). If LED chips were not placed into the package precisely, the luminescence efficiency of the overall packaging device will be influenced directly. Any deviation from the established position will prevent LED light to be reflected fully from the reflective cup, affecting LED?￠a??a?￠s brightness. So an advanced crystal solid machine with a PR System should be used in order to weld LED chips into the package precisely, without considering the quality of the lead frame. LEDs applied in different occasions and LEDs with different sizes, heat-dissipation methods and luminescence efficiency will have different types of LED packages. Currently, LED packages can be divided into the following types: Lamp-LED, TOP-LED, Side-LED, SMD-LED, High-Power-LED, Flip Chip-LED and so on.


關鍵字標籤：led module smd